good. like the 3g wire bond pull test... (you use a rubber hammer to ham the wire down to the substrate, you got pull strength of 3g with the smashed Al wire). > The IPC SMT land bond strength test method was cancelled due to > 1) uncertainty of the method > 2) ultimate tensile strength doesn't model the actual failure mode risks > very well > > Note that: > 2.4.1 has much lower uncertainty because it provides a circular land, with > hole to build ideal attachment geometry. > Ultimate tensile is not useless data, but peel strength (IPC-TM-650 2.4.8) > is generally considered a better model of foil adhesion to laminate. > > Chris Mahanna > Robisan Laboratory Inc. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun > Sent: Monday, September 28, 2015 6:45 AM > To: [log in to unmask] > Subject: [TN] Land bond strength on rigid board > > Hi Experts: > > Is there have a standard for SMT Land bond strength test? What about the > formula for force calculation? > Can I use “IPC-TM-650 2.4.21 Land Bond Strength, Unsupported Component > Hole” for reference? > > > > > Best regards > > RongJun Deng > Electronics Engineer > Design Link > > > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________