The question is why they need to use low melting temp solder - something else on the board is not allow to be heat up? if so, the finish of the parts is not a good selection (should get caught during BOM design review). Just curious. jk > Hi Mumtaz - two things we have seen that are important when soldering > NiPdAu component finishes are (1) soldering temperature/profile. Pd > dissolves much slower into Sn than other elements so running the soldering > temperatures 10 degrees hotter than typical and increasing the soldering > time 3-5 seconds longer than typical can be beneficial; (2) flux > formulation. Some fluxes work better than others when Pd is included in > the > soldering situation. Hope this helps. > > Dave Hillman > Rockwell Collins > [log in to unmask] > > On Thu, Jul 23, 2015 at 10:46 AM, Mumtaz Bora <[log in to unmask]> wrote: > >> Dear All, Good Morning, Looking for some knowledge base on soldering >> NiPdAu finished components with low melt solder such as >> Sn42.0Bi57.6Ag0.4 >> to avoid wetting issues on a heavy copper plane board. Any insight and >> advise will be appreciated. >> >> Thank-you >> Mumtaz >> 858-795-0112 >> Peregrine Semiconductor >> >> >> CONFIDENTIALITY NOTE: The information transmitted, including >> attachments, >> is intended only for the person(s) or entity to which it is addressed >> and >> may contain confidential and/or privileged material. Any review, >> retransmission, dissemination or other use of, or taking of any action >> in >> reliance upon this information by persons or entities other than the >> intended recipient is prohibited. If you received this in error, please >> contact the sender and destroy any copies of this information. >> >> ______________________________________________________________________ >> This email has been scanned by the Symantec Email Security.cloud >> service. >> For more information please contact helpdesk at x2960 or >> [log in to unmask] >> ______________________________________________________________________ >> > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________