what temp? what is glass transition temperature of the pcb? what material? what oven? i guess it is not nitrogen.... what surface finishing? without any background, no comment. jk > Fellow TechNetters: > > While some PWB coupons, 1"x1"-0.062 " thickness, were left in the > BAKING over for an extended period, 24 hrs., prior to Thermal Stress, > Solder Float. Is there any exposure with processing these sample for > cross section. I realize that if unusual artifacts are visible they > could have been induced by the over baking process. I need your > input. > > Victor, > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________