Not in the Coating Empire, so not my area to rule. More John Perry's. I am still trying to get the term "de-Douged" into T-50. Doug Pauls Principal Materials and Process Engineer Rockwell Collins On Wed, Jul 1, 2015 at 11:13 AM, Stadem, Richard D. < [log in to unmask]> wrote: > My apologies, Joel. > I had no idea that this particular segment of the industry has totally > different meanings of those terms as related to embedded circuitry. I stand > re-educated by both you and Dennis Fritz. > Perhaps we need an IPC-T50-M document just for embedded circuits! > Attention Doug Pauls! > > -----Original Message----- > From: Joel Peiffer [mailto:[log in to unmask]] > Sent: Tuesday, June 30, 2015 4:31 PM > To: Stadem, Richard D.; TechNet E-Mail Forum > Subject: RE: RE: PCB Fabrication house with Embedded > DiscreteComponentCapability > > Hi Richard, > > These may be terms that are utilized elsewhere in the electronics industry > but for Embedded Components which we are discussing below, per IPC > documentation, Formed components and Placed (or Inserted) components are > classes of embedded components. Check out the IPC documentation in > IPC-2316 and elsewhere. I have worked in the embedded components industry > for 20 years and these are the terms that are used. > > Regards, Joel > > -----Original Message----- > From: Stadem, Richard D. [mailto:[log in to unmask]] > Sent: Tuesday, June 30, 2015 3:32 PM > To: TechNet E-Mail Forum; Joel Peiffer > Subject: [EXTERNAL] RE: PCB Fabrication house with Embedded Discrete > ComponentCapability > > No, the commonly understood terms within the industry are: > > 1) "Formed components" are those whose leads are formed prior to assembly. > Examples are SMT QFPs and SOICs where the leads exit at the top of the body > and are in frames, where prior to assembly the QFP requires excision from > the frame and the leads are also formed into a gullwing shape. Another > example is through-hole axial leads bent 90 degrees and trimmed, sometimes > with a standoff bend, etc. > > 2) "Inserted components" are typically considered to be PTH components > that are inserted into PTH holes and soldered, either by hand or by axial > insertion machines along with selective or wave soldering. > > 3) "Embedded components" are those that are embedded into the PWB as part > of the PWB fabrication process. Just about every smart phone and tablet > utilizes embedded technology. There is more than one process for doing > this; conductive-ink printed and subsequently laminated PWBs, or > encapsulated, such as Joe (The Wizard) Fjelstad's Verdant Occam process. > > dean > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Peiffer > Sent: Tuesday, June 30, 2015 3:08 PM > To: [log in to unmask] > Subject: Re: [TN] PCB Fabrication house with Embedded Discrete Component > Capability > > "Inserted Components" are fully functional components such as caps, > resistors, etc. that can be inserted into boards. "Formed" components are > components that made as part of the PCB fab process. Both inserted and > formed components (mostly caps and resistors) are fairly common these days > for many products (for example, just about every smart phone and tablet > utilizes formed technology). Inserted components were probably first used > in the 1980s or early 1990s. Formed components were first used the 1960s. > > You need to define whether you mean inserted or formed as many PCB fabs > utilize one technology but few offer both. > > Regards, Joel > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer > Sent: Tuesday, June 30, 2015 12:02 PM > To: [log in to unmask] > Subject: [EXTERNAL] Re: [TN] PCB Fabrication house with Embedded Discrete > Component Capability > > Hi GA Tan- > > The question is what you mean by "discrete". For most people it means a > passive which "stands on its own" as opposed to something done with special > dielectrics and/or resistive metal layers to create passives within a > circuit board. > > For the embedding of truly discrete components, this is Joe Fjelstad's > special area. He had a shop build a demo circuit. His website covering the > technology is www.verdantelectronics.com > > The tricky part is how to electrically connect to the passives. Probably a > laser could be used to dig down to the part and then plate up a contact. > But most end terminations are covered with Sn, which is particularly > difficult to make contact to (other than with solder). > > For the other technique, using special foils and/or dielectrics, there are > a few competing products. They all seem to substantially increase the > number of steps required to make a board, and they are so > volume-inefficient that there are only a small number of cases where they > work out economically. > > Wayne Thayer > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang > Sent: Tuesday, June 30, 2015 10:13 AM > To: [log in to unmask] > Subject: [TN] PCB Fabrication house with Embedded Discrete Component > Capability > > Dear All, > I'm looking for PCB supplier who has the above capability > for proto design. Any recommendation? Thank in advance. > > Regards > GA Tan > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > 3M security scanners have not detected any malicious content in this > message. > > To report this email as SPAM, please forward it to [log in to unmask] > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > 3M security scanners have not detected any malicious content in this > message. > > To report this email as SPAM, please forward it to [log in to unmask] > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. 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