http://quicksearch.dla.mil/ -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski Sent: Friday, May 22, 2015 12:15 PM To: [log in to unmask] Subject: Re: [TN] Solderability Dip Testing Device So I got a recommendation to look at Mil-Std 202. Method 208. Anyone have a link to that free mil spec file site? Rich Kraszewski (920) 969-6075 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski Sent: Thursday, May 21, 2015 8:37 PM To: [log in to unmask] Subject: [TN] Solderability Dip Testing Device The link below describes an old school semi- automated dip device used for solderability testing : https://www.ipc.org/TM/2.4.12a.pdf The original citation for this device came from a now obsolete Military soldering specification. Does anyone recall that mil spec document number? I thought it might be in Mil Spec 28809 but I don't see it there. To cut to the chase,... I seem to recall that military specification even mentioned a manufacturer. That is what I am ultimately looking for. Any help would be appreciated. Thanks in advance Rich Kraszewski Senior Process Engineer Plexus Engineering Solutions ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________