Technetters, how can one measure solder or copper bump heights on an IC or PC board?  Heights and spacings I am interested in are in the range of 100-200 microns and 300-400 microns, respectively.

Thanks for any help.

Maybe someone in the foil business is on technet. At EXPO, there have been discussions of foil roughness measurement techniques.  My problem is, I think, an easy one by comparison.   Louis Hart

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