I can't agree that "Plate thru hole solder joints are truly indestructible." Solder is a strange material to use for mechanical connection. As a metal, it is pretty weak under the best of circumstances. Depending on temperature and rate of stress, it is EXTREMELY weak. Years ago we had a mechanical engineer who used a through-hole solder joint to maintain stress on a spring. Held for about a year! I suggest you repeat that experiment, with the through hole solder joint suspending a weight about 600mm above your keyboard and let us know how long it lasts! But we all design modules which depend on the solder as a mechanical connection. As long as the time constant of the stress is low enough (shock loads, diurnal temperature stress, etc.), it works pretty well when compared with organic adhesives (until grain growth and cyclic fatigue do their work). Wayne Thayer -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman Sent: Monday, March 30, 2015 8:47 AM To: [log in to unmask] Subject: Re: [TN] Leaded component, lead pull test Hi Victor - not much data in the public domain on that topic. About the best you can do is get a copy of the International Tin Research Institute's Publication 656 titled "Solder Alloy Data". Publication 565 contains tensile, fatigue and shear data for a number of solder alloys over various temperature and stress/strain rates. The testing we completed back in the early 1990's at Rockwell Collins on plated thru hole strength nearly always resulted in failure of the plated thru hole/laminate rather than the solder joint itself using slow tensile speeds (unpublished). Plate thru hole solder joints are truly indestructable. Dave Hillman Rockwell Collins [log in to unmask] On Fri, Mar 27, 2015 at 3:10 PM, Victor Hernandez < [log in to unmask]> wrote: > Fellow TechNetters; > > Does anyone have information on the following: > Finish hole size, lead diameter, solder type, thickness of > board and lead length. How much force does it require to pull out a lead > from the solder joint. Will the lead come out cleanly or elongated and > snap, > > Victor, > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________