Hi Bob, The J-STD states that gold shall be removed from 95% of the soldered surfaces if it is more than 2.54 micrometers thick. I think if you look at the datasheet for a lot of parts (not all parts mind you), you'll find that the gold does not exceed that thickness. So maybe you're tinning parts that you don't really need to tin... Steve On Fri, Mar 27, 2015 at 7:29 AM, Bob Wettermann <[log in to unmask]> wrote: > We have a contract where we have to place parts per JSTD-001 process > guidance (Class 2 and Class 3). > > There are some THOLE parts that are gold-plated (RF connectors) wit gold > pins and some leadless SMT devices with gold pads. > > Based on the client's interpretation of the spec all of these parts need to > be tinned. > > For such a small lot size (5 boards per P/N) are people hand tinning a few > components or send them out to be retinned? What is your experience with > the co-planarity of the leadless devices post tinning using a manual > process? > > Regards > > > -- > Bob Wettermann > BEST Inc > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > -- This email and any attachments are only for use by the intended recipient(s) and may contain legally privileged, confidential, proprietary or otherwise private information. Any unauthorized use, reproduction, dissemination, distribution or other disclosure of the contents of this e-mail or its attachments is strictly prohibited. If you have received this email in error, please notify the sender immediately and delete the original. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________