We have a contract where we have to place parts per JSTD-001 process guidance (Class 2 and Class 3). There are some THOLE parts that are gold-plated (RF connectors) wit gold pins and some leadless SMT devices with gold pads. Based on the client's interpretation of the spec all of these parts need to be tinned. For such a small lot size (5 boards per P/N) are people hand tinning a few components or send them out to be retinned? What is your experience with the co-planarity of the leadless devices post tinning using a manual process? Regards -- Bob Wettermann BEST Inc ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________