Fellow TechNetters: Where can I find information regarding delamination? Are the laminate material separation artifact of thermal excursion, solder float test, 3x or 6x, differ from that of an exothermic event in which current/heat melts the laminate and/or heat exploded/cracking the laminate. Victor, ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________