在 2014-11-27 10:21:05，"Yu Xiang" <[log in to unmask]> 写道：

各位，

    IPC最新F版本有很多改變，有關貫穿孔Hole-Fill之前接地GND or電源大銅箔Pin允許>50%或1.19mm小者為準，現在F版本的不是以GND-Pin和信號Pin區分，而是以元件的Pin數是否大於14來區分，小於14個Pin的要求大於50%或1.2mm小者為準，大於14個Pin的要求>75%。PTH電容來說GND Pin原來只要求>50%，現在按照F版本就要>75%，標準變嚴格了，似乎對組裝廠是有困難的，尤其是OSP的厚板，大家是否遇到相同問題？

Best Regards!

                 Yu Xiang 

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