Hi team - thanks to everyone for the recommendations and suggestions. We had already begun some trials with the temporary mask material but I wanted to double check if any other possibilities existed. Wayne - the reason for the "temporary" caveat was that if I use a permanent material such as an edgebond adhesive, I potential may be required to conduct testing as the assembly configuration would be different than what was ran thru qualification testing. If I can find a temporary mask option, I can avoid having to deal with those aspects of the topic. TechNet is such an awesome resource! Dave On Tue, Dec 9, 2014 at 8:09 AM, Wayne Thayer <[log in to unmask]> wrote: > Seems like perfect use for a staking adhesive, except for your strange > requirement that it be easily removable. Staking adhesives enhance > reliability > by assisting with strengthening the mechanics at the corner balls, and are > known to increase the resistance to shock loads too. > > So if you're stuck with this strange set of requirements, then I doubt > you'll > find something pre-qualified for it. So since qualification is required, > anything is open game. I'd play with water washable solder masking > materials, > also peelable masking material. > > Wayne Thayer > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman > Sent: Tuesday, December 09, 2014 8:42 AM > To: [log in to unmask] > Subject: [TN] BGA Reflow Issue > > Hi gang - looking for an adhesive suggestion. I have an assembly in which a > heavy BGA was accidently located on process side one (bottom) so that when > we > reflow process side two (top) the BGA is doing its best to fall off. > Unfortunately I can't reverse my process order for a couple of reasons so > I am > looking for a temporary fix until I can get the assembly revised. I was > thinking of using some type of adhesive to temporarily hold the BGA in > place > during reflow - tack down the corners sort of action. Does anyone have any > adhesive (ideally temporary, water washable/removable) suggestions I can > investigate? > > TIA > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________