Do check the plating material of the lead/terminal. Bright tin is not good.
Hi All,
We are facing the dry joints after reflow soldering and the defective rate is 5%, could you share with me what reason for caused this case?
Note:
1. The solder paste, component and PCB are unchanged;
2. The component and solder pads are free of oxidation/contamination;
3. The reflow soldering temperature profile as shown below:
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Thanks in advance!
Best regards,
Justin