請問一下你們的鍍金曾要求厚度是多少 如果金厚不夠這種現象會出現的 From: TGAsia [mailto:[log in to unmask]] On Behalf Of 王道群 Sent: Friday, September 05, 2014 12:13 PM To: [log in to unmask] Subject: Re: [TGAsia] PCB鍍金層在回流焊後出現斑點 斑点应该是镀金下面的镍 在 2014-09-05 11:01:00,"Justin Wu" <[log in to unmask]> 写道: 各位專家, 請問PCB鍍金層在回流焊後出現斑點是何原因(注:不印刷锡膏也同樣存在類似問題)? Thanks in advance! Best regards, Justin __________ Information from ESET Endpoint Antivirus, version of virus signature database 10365 (20140904) __________ The message was checked by ESET Endpoint Antivirus. http://www.eset.com ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ TGAsia是一个为业界同仁提供技术交流的平台。您可以在论坛上提出技术问题,交流行业经验,寻找供应商等。请勿发送任何招聘,广告信息。(注:对于寻求供应商的邮件,请勿回复[log in to unmask] <mailto:请勿回复[log in to unmask]> ,请私下和发件人联系)。如您需要退出该邮件论坛,请直接发送邮件至 [log in to unmask] ,谢谢。 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ TGAsia是一个为业界同仁提供技术交流的平台。您可以在论坛上提出技术问题,交流行业经验,寻找供应商等。请勿发送任何招聘,广告信息。(注:对于寻求供应商的邮件,请勿回复[log in to unmask],请私下和发件人联系)。如您需要退出该邮件论坛,请直接发送邮件至 [log in to unmask] ,谢谢。 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________