Thank you Dave. That's exactly what I thought. Regards, Vladimir Sent from my BlackBerry 10 smartphone on the Rogers network. Original Message From: David Hillman Sent: Friday, September 19, 2014 9:50 AM To: TechNet E-Mail Forum; Vladimir Igoshev Subject: Re: [TN] Au embrittlement Hi Vlad - yes, any Sn based solder would be susceptible to gold embrittlement since the other major element constituents don't specifically participate in the SnAu intermetallic (IMC) reaction. The other elements may inhibit the reaction by being a "more favored" IMC - the presence of copper has been shown to do this. Take a look at Julie Silk's papers at SMTAI 2013 and the paper at SMTAI 2014 in a couple weeks for additional details. Dave On Fri, Sep 19, 2014 at 8:17 AM, Vladimir Igoshev <[log in to unmask]> wrote: I'm trying to find information on whether Sn-Bi based solders are susceptible to Au embrittlement in a similar way as Sn and Sn-Pb-based solders do. I don't see why they wouldn't but need some confirmation. As always, thank you very much in advance for constructive answers. Regards, Vladimir Sent from my BlackBerry 10 smartphone on the Rogers network. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________