That depends on hole type and class of hardware, see Tables 6.2 and 6.3 in J-STD-001. Ben From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, August 06, 2014 4:23 PM To: Gumpert, Ben; [log in to unmask] Cc: [log in to unmask] Subject: EXTERNAL: RE: Post solder Component lead trimming Ben, Is there an associated min/max value with lead protrusion, 0.062 inches. Victor, -----Original Message----- From: Gumpert, Ben [mailto:[log in to unmask]] Sent: Tuesday, August 05, 2014 8:57 AM To: TechNet E-Mail Forum; Hernandez, Victor G Subject: RE: Post solder Component lead trimming Victor, J-STD-001 Rev E Para. 6.1.4 states that leads trimmed shall have the solder reflowed or inspected at 10X for damage. And if the trim cuts into the solder fillet, it must be reflowed. Ben -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Tuesday, August 05, 2014 9:33 AM To: [log in to unmask]<mailto:[log in to unmask]> Subject: EXTERNAL: [TN] Post solder Component lead trimming Fellow TechNetters: Does IPC Standards address the lead trimming of components on post solder assemblies. I heard that on post solder lead trimming that a second pass solder operation is required to ensure solder joint integrity from the lead trimming process. Any comments and/or direction for literature review. Victor, ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________