Hello All,

Bring back an old topic for clarification and seeking more details on this.

Few application note says that the solder wicking is not seen when the through hole via drill size is kept equal to 0.3mm(0.012") or less
Few application note recommend to fill the vias used on Thermal pad on QFN devices - epoxy or capping  on all via sizes.

Please advise is solder wicking  do happen on through hole via drill size 0.3mm(0.012") or less? i.e. solder wicking Vs the via drill size
Is this applicable to passive parts using Though via in pad? Because I see the pad area Vs solder quantity difference between a thermal pad and a passive component pad.

Appreciate any information on this topic.

Thanks,
Nagaraj.




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