请不要把删除地址的邮件发给所有人。

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Johnny Man
Sent: 2014年7月9日 9:52
To: [log in to unmask]
Subject: Re: [TGAsia] 关于混合集成电路封装后水汽超标问题

请删除我的邮件地址([log in to unmask]<mailto:[log in to unmask]>). 谢!

From: TGAsia [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of [log in to unmask]<mailto:[log in to unmask]>
Sent: Wednesday, July 09, 2014 9:47 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TGAsia] 关于混合集成电路封装后水汽超标问题

我的建议是:
1.    待扑胶(灌封)产品扑胶之前必须作预热处理,例如在120°高温下至少烘烤1~2小时,然后冷却至60°左右立刻开始扑胶处理
2.    严格按照胶料的烘干工艺进行烘烤固化;
3.    选择吸水率较低的胶料作为最佳扑胶材料。

上述建议供你参考!谢谢!
____________________
Thanks and best regards,
Harry Liu
Teka Interconnection Systems
Tel: 86-755-27099753  Fax:27099652
Cell: 18923801962         Skype:harrylau2008
E-mail:[log in to unmask]<mailto:[log in to unmask]>
Website: http://www.tekais.com<http://www.tekais.com/>
http://www.tekais.com/animation.htm



From:        xjq <[log in to unmask]<mailto:[log in to unmask]>>
To:        <[log in to unmask]<mailto:[log in to unmask]>>
Date:        07/09/2014 12:30 AM
Subject:        [TGAsia] 关于混合集成电路封装后水汽超标问题
Sent by:        TGAsia <[log in to unmask]<mailto:[log in to unmask]>>
________________________________



各位同行:
      有个问题咨询一下,我这边在开发混合集成电路,H级厚膜电源产品,之前产品没问题,最近在封后进行水汽含量测试时,超过了5000ppm,内部磁罐用的胶不少。
      查了氮气浓度、手套箱露点、技术状态等,都没有发现问题,后来延长了封前烘烤时间(30小时),效果也不理想,想问问还可能有什么原因?如何解决?


[log in to unmask]<mailto:[log in to unmask]>
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TGAsia是一个为业界同仁提供技术交流的平台。您可以在论坛上提出技术问题,交流行业经验,寻找供应商等。请勿发送任何招聘,广告信息。(注:对于寻求供应商的邮件,请勿回复[log in to unmask],请私下和发件人联系)。如您需要退出该邮件论坛,请直接发送邮件至 [log in to unmask]<mailto:[log in to unmask]> ,谢谢。
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