As far as PWB goes it has to be polyimide material (Tg 260) to withstand the harsh environment. I am not aware of other options for down hole application. Best regards, Jason Zhao VP of North America Operations Sunshine Global PCB Group US Cell 510-468-4412, China Cell 131-62722392 High Mix, High Tech, Low-Mid Volume PCB Manufacturer www.sunshinepcbgroup.com -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins Sent: Thursday, June 05, 2014 8:55 AM To: [log in to unmask] Subject: Re: [TN] high temp environment To clarify - the proposed project is one we will build, we are not involved in the design other than performing manufacturability reviews on it. Our part is looking like assembly of the circuit board and potentially potting the board into it's carrier. The client is well versed in the design side of things. regards, Graham Collins Senior Process Engineer Sunsel Systems (902) 444-7867 ext 211 On 6/5/2014 10:38 AM, Brian Ellis wrote: > Absolutely, the only sensible approach! > > Beian > > On 05.06.2014 16:13, Steven Creswick wrote: >> Graham, >> >> Back in the day, we would have approached as much as we could with >> hybrid technology. >> >> Eutectic die attach on ceramic [High temp co-fired ceramic, alumina >> substrate within metal package, or Low Temp Co-fired ceramic], etc. >> Way back, there was even eutectic attach for passives - if properly >> metallized... >> >> Being in a hermetic package, no conformal coatings... >> >> Being a potentially highly corrosive environment the package is truly >> put to the test. Drawing upon implantable medical technologies [also >> a corrosive environment, believe it or not], there are multiple >> packaging options available including stainless & titanium. >> >> Just a different persective... >> >> Steve Creswick >> Sr Associate - Balanced Enterprise Solutions >> http://www.linkedin.com/in/stevencreswick >> 616 834 1883 >> >> >> >> >> >> >> _____________________________________________________________________ >> _ This email has been scanned by the Symantec Email Security.cloud >> service. >> For more information please contact helpdesk at x2960 or >> [log in to unmask] >> _____________________________________________________________________ >> _ >> > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________