Interesting, printing would fill the dimple. I had not considered that problem. Dispensing would be an issue too. Those are pretty significant tolerances. Maybe the committee that writes that standard should revisit. Looks like you are going to need a note on your drawing. For most BGAs the majority of solder comes from the Ball, but you must have enough paste to get good contact with the ball. How deep is your deposit? Guy -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Roland Jaquet Sent: Friday, May 23, 2014 11:48 AM To: [log in to unmask] Subject: [TN] Dimples - Bumps - SolderJetting Dear Technetters, We have an issue with BGA and vias in pad and the usual flatness required for assembly and Solderjetting. The IPC-6012C for Class 3, says it is acceptable for Dimples up to 75µm and bumps up to 50µm … At the assembly line, they do not want Bumps and almost no Dimples (max 25µm) Do we have any Pro/Con experiences as to where to lead and define boundaries for it? Is there some more specs in regard of SolderJetting ? Thank you for your help Best Regards Roland ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________