Hi all

I've got a case where wires have been soldered by hand into THT PCBs. Obviously the producer had problems in the process and applied so much heat that the resin around the plated barrel is burned and the resin separated from the barrel nearly on the entire length. It is now argued that the solder joints are acceptable to IPC A-600 since resin recession is assigned as acceptable without a limitation to the extent of the defect. Is it really acceptable that the barrel may be virtually hanging free in the drilled hole?


Best regards


Günter


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