When I was at Nortel in the 1990s we developed "standard" expected pull and shear values for common SMT components using a Dage device. Another Nortel site did the same thing using an Instron. Guess what? The compared results were within the range of standard deviations we developed from the data. But other than telling you if you have the potential for a gross failure, what does this data give you? Not much. Bev -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M. [Contractor] Sent: Wednesday, March 12, 2014 8:56 PM To: [log in to unmask] Subject: [TN] FW: Solder Joint Interconnect Pull Strength Tests - Standards? Steve, I responded to Todd's TN post off-line but then realized that there might be others at TN who might want to see what I sent Todd. I've attached a PDF file with the info in case you'll be able to put it up on your site. Regards, George George M. Wenger Failure Signature & Characterization Lab LLC 609 Cokesbury Road, High Bridge, NJ 08829 (908) 638-8771 Home (732) 309-8964 Mobile E-mail [log in to unmask] [log in to unmask] -----Original Message----- From: Wenger, George M. [Contractor] Sent: Wednesday, March 12, 2014 1:01 PM To: 'MacFadden, Todd' Subject: RE: Solder Joint Interconnect Pull Strength Tests - Standards? Hi Todd, I'm not sure that this is what you are looking for. There really isn't any recognized industrial pull strength specifications. The attached shows what we did many years ago when we first started seeing what we called "Double Reflow" defects. At that time we found that typical 50 mil pitch gull wing lead solder joints had a pull strength of approximately 1Kg force (2.2 lbms) when pulled at room temperature and the pull strength decreased linearly with temperature. When we did pull strength testing we were much more interested in the mode of failure rather than the strength. We always wanted to see cohesive failures in the solder and not adhesive failures at an interface. I hope you get some usefull information from the attached. Regards, George George M. Wenger Failure Signature & Characterization Lab LLC 609 Cokesbury Road, High Bridge, NJ 08829 (908) 638-8771 Home (732) 309-8964 Mobile E-mail [log in to unmask] [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of MacFadden, Todd Sent: Wednesday, March 12, 2014 12:04 PM To: [log in to unmask] Subject: [TN] Solder Joint Interconnect Pull Strength Tests - Standards? Is anyone aware of standards for conducting and evaluating lead pull tests, and are there typical expected lead pull (or push) values for the common interconnects (i.e., gull wing, castellation, BGA, chip cap terminals, etc). Perhaps there are too many variables -- e.g., type, finish, configuration and size of the lead; solder type, etc. -- to establish standard pull strength values. We've always just used relative comparison of values from sample lots against controls, but I'm wondering if there are typical expected pull strength values from industry we can reference. I noted from MIL-STD-1580B: 10.1.1.2 Terminal strength. Perform a lead pull strength test on all parts (two parts minimum) in accordance with the applicable specification. But what is the "applicable specification" being referred to here? Thanks in advance! Todd MacFadden ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________