Hi Michael: 這種特殊封裝, 理論上應該是MCM(multi chip module), 多顆芯片非對稱擺放可能造 成warpage, 進而對錫球產生應力. 一般封裝大廠會進行shadow morrie與MSL驗證, 或Board Level上板驗證應可篩選出warpage或CTE mismatch等問題. 亦或在EMS端加 上Underfill來減少在錫球上的應力, 但會增加費用/工序與返工問題. 建議您先從異常品上確認問題, 再研議後續分析規劃. Yenchi / 陳彥奇 iST-Kunshan (昆山宜特科技) Engineering Director ======================================================= Office : +86-512-57639600 EXT 6700 Mobile : +86-13914965712 Address : 江蘇省昆山市昆嘉路351號 郵編215300 No.351,Kunjia road,Kunshan city,Jiangsu province,China. Post:215300 Skype: johnchen300 ======================================================= iST Group(宜特/宜碩) FIB / FA / Reliability / MA / Chemical(RoHS/REACH) Laboratory Lab. Location : Shanghai, Kunshan, Beijing, Shenzhen, Taiwan US : Sunnyvale Website : www.istgroup.com / www.isti.com.cn Chen Hao <[log in to unmask]> Sent by: TGAsia <[log in to unmask]> 2013-12-25 14:12 Please respond to <[log in to unmask]> To <[log in to unmask]> cc Subject [TGAsia] IC 焊接问题 Hi All 请问同行这样封装的IC,Reflow条件及生产过程中是否有特别需要注意的点? 另外,这种封装的IC四个角落是否特别容易出现Crack现象?该如何避免及预防? 以上,谢谢! BR, Michael ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ TGAsia是一个为业界同仁提供技术交流的平台。您可以在论坛上提出技术问题,交流 行业经验,寻找供应商等。请勿发送任何招聘,广告信息。(注:对于寻求供应商的 邮件,请勿回复[log in to unmask],请私下和发件人联系)。如您需要退出该邮件论坛 ,请直接发送邮件至 [log in to unmask] ,谢谢。 [attachment "IC.JPG" deleted by Yenchi Chen/istc] ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________