Bob, We 100% inspect all product (low volume, high mix, complex designs, class 2 and 3) received from various contract manufacturers and we consistently identify defects that the contract manufacturer's AOI and X-Ray missed (Examples: component cant, component damage, laminate issues, solder volume, missing components, solder balls violating minimum electrical clearance, head in pillow...........). There is no substitute for the trained eye. Eva J On Wed, Oct 23, 2013 at 8:26 AM, Ioan Tempea <[log in to unmask] > wrote: > Bob, > > For class 3 boards of that complexity you cannot rely on visual inspection > to weed out 100% of the quality problems! What you want is visual + AOI + > X-Ray and also functional test. No functional test, no certainty that > you've caught everything. On top of it, testing has to have a proper > coverage. > Then, you'll need some screening, like thermal shock or burn-in, in order > to catch infant mortality issues that get away even after having done all > the above. > > And this will, eventually, ensure good quality, which means good > workmanship. But things don't have to stop here either, as you have no idea > about the long term reliability of the product, which is intimately related > to design (Werner would have had many things to say here). > So you'll need to wrap it up with proper ESS screening. > > But now that I'm done ranting, I see your mandate is to perform inspection > only. Maybe you could get away with the reliability part, but I don't > believe you can commit to properly fulfilling your mandate without > functional test and infant mortality screening. Believe me, I've been down > that path. 4000 parts and this complexity means that, if you judge based on > DPMO, there is at least one defect on each board. Try and find it! > > To end on a sweeter note, of course you could commit to the task, if not > you, somebody else will, but make sure the contract has provisions that > will allow your company to fight the endless spiral of customer returns. > > Regards, > > Ioan Tempea > > This e-mail, and any attachments, are intended solely for the use of the > intended recipient(s) and may contain legally privileged, proprietary > and/or confidential information. Any use, disclosure, dissemination, > distribution or copying of this e-mail and any attachments for any purposes > that have not been specifically authorized by the sender is strictly > prohibited. If you are not the intended recipient, please immediately > notify the sender by reply e-mail and permanently delete all copies and > attachments. > > -----Message d'origine----- > De : TechNet [mailto:[log in to unmask]] De la part de Bob Wettermann > Envoyé : Tuesday, October 22, 2013 4:16 PM > À : [log in to unmask] > Objet : [TN] Inspecting Class 3 Assemblies > > Dear Technetters: > > I think these things come in bunches. > > We are being asked to perform contract inspection of Class 3 medical PCBs. > I would categorize this board as "high complexity" with BGAs, UHDI > connectors, 0201s and about 4,000 parts. There are 100+ boards. > > Obviously performing this manually will would take many hours and based on > previous experience, be only 80% effective using a single set of eyes. > > So my question for those of you building IPC-A-610 Class 3 product for > mil, aerospace or medical is how do you insure that class 3 solder joint > and other inspection criteria are met? The AOI we have will not do the > trick! > The leadless devices and BGAs we will inspect via XRAY. Other ideas for > doing this "offline"? > > Bob W/BEST > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________