Hi Bob, We do. It on a daily base for our customers and the major tool (besides visual and X-ray) is cross-sectioning. Please contact me off line if you need help. Regards, Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca -----Original Message----- From: Bob Wettermann <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Tue, 22 Oct 2013 15:16:19 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Bob Wettermann <[log in to unmask]> Subject: [TN] Inspecting Class 3 Assemblies Dear Technetters: I think these things come in bunches. We are being asked to perform contract inspection of Class 3 medical PCBs. I would categorize this board as "high complexity" with BGAs, UHDI connectors, 0201s and about 4,000 parts. There are 100+ boards. Obviously performing this manually will would take many hours and based on previous experience, be only 80% effective using a single set of eyes. So my question for those of you building IPC-A-610 Class 3 product for mil, aerospace or medical is how do you insure that class 3 solder joint and other inspection criteria are met? The AOI we have will not do the trick! The leadless devices and BGAs we will inspect via XRAY. Other ideas for doing this "offline"? Bob W/BEST ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________