Gents: Lyon wrote "Bob, After removed BGA, we found pad of BGA was missing." From what the patient is telling us it happened UPON REMOVAL (not during reballing process) Bob W On Wed, Sep 4, 2013 at 11:18 AM, Stadem, Richard D. < [log in to unmask]> wrote: > I don't think so, as then the other pads would also display varying > degrees of erosion. This appears to be a pad that was lifted during the > reballing process, as part of the pad prep after rework (removal of the old > solder). > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben > Sent: Wednesday, September 04, 2013 9:20 AM > To: [log in to unmask] > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > Or potentially too much time at liquidus dissolved the pad away, or left > minimal pad that was easily lifted. > > Ben > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory > Sent: Wednesday, September 04, 2013 10:16 AM > To: [log in to unmask] > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > Well, well, well....there's your answer. I think someone did not have a > delicate touch when they cleaned the pads... > > Steve > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan > Sent: Wednesday, September 4, 2013 8:14 AM > To: [log in to unmask] > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > Hi Steve > > > > Yes, it was re-balled > > > > Lyon Yuan > > > > From: stephen gregory [mailto:[log in to unmask]] > Sent: Wednesday, September 04, 2013 10:11 PM > To: Lyon Yuan; TechNet E-Mail Forum > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > > > Hi Lyon! > > > > Have your picture posted, it's here: > > > > http://stevezeva.homestead.com/Pad_missing.JPG > > > > Do you know if this BGA was re-balled? > > > > Steve > > > > From: Lyon Yuan <[log in to unmask]> > To: 'stephen gregory' <[log in to unmask]>; 'Steve Gregory' > <[log in to unmask]> > Sent: Wednesday, September 4, 2013 8:00 AM > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > > > Steve, > > > > Help to upload picture to web. Thanks > > > > Lyon Yuan > > > > > > -----Original Message----- > From: Wenger, George M. [Contractor] [mailto:[log in to unmask]] > Sent: Wednesday, September 04, 2013 9:54 PM > To: Lyon Yuan > Cc: stephen gregory; Steve Gregory > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > > > Lyon, > > > > Attached is a link to his site. The last emails I had for Steve are on > the copy to line of this email <http://stevezeva.homestead.com/> > http://stevezeva.homestead.com/ > > > > > > Regards, > > George > > George M. Wenger > > Failure Signature & Characterization Lab LLC > > 609 Cokesbury Road, High Bridge, NJ 08829 > > (908) 638-8771 Home (732) 309-8964 Mobile > > E-mail: <mailto:[log in to unmask]> [log in to unmask] > > <mailto:[log in to unmask]> [log in to unmask] > > > > > > -----Original Message----- > > From: Lyon Yuan [mailto:[log in to unmask]] > > Sent: Wednesday, September 04, 2013 9:45 AM > > To: Wenger, George M. [Contractor] > > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > > > George > > > > Thanks, steve's email? > > > > Lyon Yuan > > > > -----Original Message----- > > From: Wenger, George M. [Contractor] [mailto:[log in to unmask]] > > Sent: Wednesday, September 04, 2013 9:35 PM > > To: TechNet E-Mail Forum; Lyon Yuan > > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > > > Hi Lyon, > > > > You might want to send the picture to Steve to post on his site so we all > can see it. > > > > Regards, > > George > > George M. Wenger > > Failure Signature & Characterization Lab LLC > > 609 Cokesbury Road, High Bridge, NJ 08829 > > (908) 638-8771 Home (732) 309-8964 Mobile > > E-mail: <mailto:[log in to unmask]> [log in to unmask] > > <mailto:[log in to unmask]> [log in to unmask] > > > > > > -----Original Message----- > > From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan > > Sent: Wednesday, September 04, 2013 9:32 AM > > To: [log in to unmask] > > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > > > Hi Ben, > > > > I send a clear picture for your reference > > > > Lyon Yuan > > > > -----Original Message----- > > From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of > Gumpert, Ben > > Sent: Wednesday, September 04, 2013 8:04 PM > > To: [log in to unmask] > > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > > > Lyon, > > > > I haven’t seen that. > > Typically the pads on the BGA are solder mask defined, which makes them > much more secure than the usual non-solder mask defined pads on the PWB. > > > > Ben > > > > From: [log in to unmask] [mailto:[log in to unmask]] > > Sent: Wednesday, September 04, 2013 7:04 AM > > To: Gumpert, Ben > > Cc: TechNet > > Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop > > > > hi ben, > > > > it is pad missing from bga > > 在2013/09/04, "Gumpert, Ben" < <mailto:[log in to unmask] > 3cmailto:[log in to unmask]> [log in to unmask]<mailto: > [log in to unmask]>> 写道: > > Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) > Usually this means that there wasn't enough heat - that the solder was not > melted in all locations. Ben -----Original Message----- From: TechNet > <mailto:[mailto:[log in to unmask]]> [mailto:[log in to unmask]] On Behalf Of > Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To: <mailto: > [log in to unmask]:[log in to unmask]> [log in to unmask]<mailto: > [log in to unmask]> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few > BGA pad drop after removed from pcba boards.what is reason to cause the > issue > ______________________________________________________________________ This > email has been scanned by the Symantec Email Security.cloud service. For > more information please contact helpdesk at x2960 or <mailto: > [log in to unmask]:[log in to unmask]> [log in to unmask]<mailto: > [log in to unmask]> > ______________________________________________________________________ > ______________________________________________________________________ This > email has been scanned by the Symantec Email Security.cloud service. For > more information please contact helpdesk at x2960 or <mailto: > [log in to unmask]:[log in to unmask]> [log in to unmask]<mailto: > [log in to unmask]> > ______________________________________________________________________ > > > > ______________________________________________________________________ > > This email has been scanned by the Symantec Email Security.cloud service. > > For more information please contact helpdesk at x2960 or <mailto: > [log in to unmask]> [log in to unmask] > > > > ______________________________________________________________________ > > This email has been scanned by the Symantec Email Security.cloud service. > > For more information please contact helpdesk at x2960 or <mailto: > [log in to unmask]> [log in to unmask] > > > > > > > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > -- 1. Bob Wettermann 847-767-5745 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________