And it was not left behind on the PWB pad? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 9:32 AM To: [log in to unmask] Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop Bob, After removed BGA, we found pad of BGA was missing Lyon Yuan -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Bob Wettermann Sent: Wednesday, September 04, 2013 10:25 PM To: [log in to unmask] Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop Do we know where in the process the defect occured? Was it after device removal? At site prep? After reballing? Bob On Wed, Sep 4, 2013 at 9:10 AM, stephen gregory < [log in to unmask]> wrote: > Hi Lyon! > > Have your picture posted, it's here: > > http://stevezeva.homestead.com/Pad_missing.JPG > > Do you know if this BGA was re-balled? > > Steve > > > ________________________________ > From: Lyon Yuan <[log in to unmask]> > To: 'stephen gregory' <[log in to unmask]>; 'Steve Gregory' > <[log in to unmask]> > Sent: Wednesday, September 4, 2013 8:00 AM > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > > > Steve, > > Help to upload picture to web. Thanks > > Lyon Yuan > > > -----Original Message----- > From: Wenger, George M. [Contractor] > [mailto:[log in to unmask]] > Sent: Wednesday, September 04, 2013 9:54 PM > To: Lyon Yuan > Cc: stephen gregory; Steve Gregory > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > Lyon, > > Attached is a link to his site. The last emails I had for Steve are > on the copy to line of this email http://stevezeva.homestead.com/ > > > Regards, > George > George M. Wenger > Failure Signature & Characterization Lab LLC > 609 Cokesbury Road, High Bridge, NJ 08829 > (908) 638-8771 Home (732) 309-8964 Mobile > E-mail: [log in to unmask] > [log in to unmask] > > > -----Original Message----- > From: Lyon Yuan [mailto:[log in to unmask]] > Sent: Wednesday, September 04, 2013 9:45 AM > To: Wenger, George M. [Contractor] > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > George > > Thanks, steve's email? > > Lyon Yuan > > -----Original Message----- > From: Wenger, George M. [Contractor] > [mailto:[log in to unmask]] > Sent: Wednesday, September 04, 2013 9:35 PM > To: TechNet E-Mail Forum; Lyon Yuan > Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop > > Hi Lyon, > > You might want to send the picture to Steve to post on his site so we > all can see it. > > Regards, > George > George M. Wenger > Failure Signature & Characterization Lab LLC > 609 Cokesbury Road, High Bridge, NJ 08829 > (908) 638-8771 Home (732) 309-8964 Mobile > E-mail: [log in to unmask] > [log in to unmask] > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan > Sent: Wednesday, September 04, 2013 9:32 AM > To: [log in to unmask] > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > Hi Ben, > > I send a clear picture for your reference > > Lyon Yuan > > -----Original Message----- > From: [log in to unmask] [mailto:[log in to unmask]] On Behalf > Of Gumpert, Ben > Sent: Wednesday, September 04, 2013 8:04 PM > To: [log in to unmask] > Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop > > Lyon, > > I haven’t seen that. > Typically the pads on the BGA are solder mask defined, which makes > them much more secure than the usual non-solder mask defined pads on the PWB. > > Ben > > From: [log in to unmask] [mailto:[log in to unmask]] > Sent: Wednesday, September 04, 2013 7:04 AM > To: Gumpert, Ben > Cc: TechNet > Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop > > hi ben, > > it is pad missing from bga > 在2013/09/04,"Gumpert, Ben" <[log in to unmask]<mailto: > [log in to unmask]>> 写道: > Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the > BGA?) Usually this means that there wasn't enough heat - that the > solder was not melted in all locations. Ben -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: > Wednesday, September 04, 2013 6:40 AM To: > [log in to unmask]<mailto:[log in to unmask]> > Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop > after removed from pcba boards.what is reason to cause the issue > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud > service. For more information please contact helpdesk at x2960 or > [log in to unmask] <mailto:[log in to unmask]> > ______________________________________________________________________ > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud > service. For more information please contact helpdesk at x2960 or > [log in to unmask]<mailto: > [log in to unmask]> > ______________________________________________________________________ > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ________________ > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ________________ > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ______________________________________________________________________ > -- 1. Bob Wettermann 847-767-5745 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________