Victor, have a look at picture 10-49 and 10-50. There you can see SMD-Components on lifted pads. But written criteria always take precedence over illustrations. There is no distinction between SMD and PTH Pads in the describing text. Regards Frank Von: Victor Hernandez <[log in to unmask]> An: <[log in to unmask]> Datum: 07.08.2013 18:55 Betreff: [TN] IPC-610E, section 10.3.2, Conductors/Lands - Lifted Pads/Lands (Con't) Gesendet von: TechNet <[log in to unmask]> Fellow TechNetters: Can someone else interpret the stated criteria for section 10.3.2. Figures 10-48 thru 50. Does this criteria solely pertain to PTH/conductor lands or is this also pertain to Surface Mount Pads, J-Leads, Gull Wing, SMT, etc.... I don't see how the industry can permit lifted copper pads from the laminate. Is this criteria for Post soldiering Process or what? Victor, ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ . Der Inhalt dieser E-Mail ist für den Absender rechtlich nicht verbindlich. Informieren Sie uns bitte, wenn Sie diese E-Mail fälschlicherweise erhalten haben (Fax: +49-7551-891-4001). Bitte löschen Sie in diesem Fall die Nachricht. Jede Form der weiteren Benutzung ist untersagt. . The content of this e-mail is not legally binding upon the sender. If this e-mail was transmitted to you by error, then please inform us accordingly (Fax: +49-7551-891-4001). In such case you are requested to erase the message. Any use of such e-mail message is strictly prohibited. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________