Much noise for a single void. 30% tells me it wasn't from the soldering process but existed even before. With other words a defect ball. The failure seems to be far out from Weibull's cc, i.e. <6S, so it's not worth much more jogging. Inge On 30 July 2013 20:25, David D. Hillman <[log in to unmask]>wrote: > Hi Leland - I love the supplier's comment as the existence of the 30% void > demonstrates the statement to not be true. Was the 30% void an observation > or was it associated with an component failure? Do you have open microvias > in the pads? Also - the JSTD-001 committee is revising the BGA void > criteria to 30% based on a series of test results submitted to the > committee. > > Dave > > > > From: Leland Woodall <[log in to unmask]> > To: <[log in to unmask]> > Date: 07/30/2013 01:19 PM > Subject: [TN] Singular 30% Void and Oversize Ball Diameter > Sent by: TechNet <[log in to unmask]> > > > > Folks, > > We run thousands of boards a day, and almost every one carries a BGA. We > inspect each with inline X-ray. > > Last week, we had one single ball to fail for a 30% void and an oversize > diameter. We contacted the supplier, and they said their process was > incapable of sending out such a defect. > > We've never had a void over 5%, and even those are incredibly rare. > > What within our process might have caused this, and do you agree with the > statement of the supplier? How do you recommend we analyze the failure? > > Thanks in advance for your help! > > Leland > > ________________________________ > > ?Confidentiality Notice: > This transmission (including any attachments) may contain confidential > information belonging to the sender and is intended only for the use of > the party or entity to which it is addressed. If you are not the intended > recipient, you are hereby notified that any disclosure, copying, > distribution, retention or the taking of action in reliance on the > contents of this transmission is strictly prohibited. If you have received > this transmission in error, please immediately notify the sender and erase > all information and attachments.? > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________