Contaminate by solder mask process? Thickness of OSP? Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis Sent: Monday, July 15, 2013 8:35 AM To: [log in to unmask] Subject: Re: [TN] What are all the probable causes of non-wetting for OSP board test pads when the circuit boards are run through our reflow In order, the most probable first: - the underlying copper has not been correctly cleaned before applying the OSP - the underlying copper has been brushed, pumiced or otherwise treated with an abrasive - the underlying copper, if electrolytic, has been deposited from a badly controlled/filtered solution, causing co-deposits of organic additives or simply particulate contamination - your OSP has passed its sell-by date Brian On 15.07.2013 14:19, Lyon Yuan wrote: > Hi All, > What are all the probable causes of non-wetting for OSP board test > pads when the circuit boards are run through reflow? > > Lyon Yuan > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________