IPC New Release: IPC-4412B
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass)
borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once melted, the glass formed loses all relation to the raw metal oxides, including the network forming boron
oxides or borates. This specification includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. Supersedes IPC-4412A with Amendments 1, 2 and 3, IPC-EG-140 with Amendments 1 & 2 and, in turn,
IPC-EG-140.
27 pages. Released June 2013.
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IPC New Release: J-STD-002D
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for
the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC.
49 pages. Released June 2013.
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IPC New Release: 4552-WAM1-2
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
In answer to numerous industry requests for guidance on electroless nickel/immersion gold (ENIG), IPC-4552 was developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish
for printed boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It is an invaluable resource for use by suppliers, board fabricators, electronics manufacturing service (EMS) providers and original equipment manufacturers
(OEMs). The specification's Appendix also includes a FREE copy of the highly sought-after technical paper, “Standard Developments Efforts of Electroless Nickel Immersion Gold,” by George Milad and Gerard O’Brien. The ENIG board surface finish is an electroless
nickel layer capped with a thin layer of immersion gold. The immersion gold protects the underlying nickel from oxidation or passivation over its intended life. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit
connections, and as a contact surface. The addition of Amendments 1 & 2 to this document provides for the use of thinner immersion gold, down to 0.04 microns (1.58 microinches), than was previously allowed at 0.05 microns (1.97 microinches). However, such
thinner gold can only be utilized when the electrical connection is to be made via soldering. Also, the rules by which rework and/or repair of a printed board's ENIG surface finish are now defined.
33 pages. Released December 2012.
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