IPC New Release: IPC-9641

High Temperature Printed Board Flatness Guideline

 

Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room temperature at the beginning and end of the assembly process. This document aims to provide guidance on methods and procedures for critically evaluating the relative change in shape (printed board flatness) of local areas of interest (e.g., BGA land area) during a simulated temperature reflow cycle.

20 pages. Released July 2013.

Preview the table of contents .pdf file.

Hard copy:

Member Price:   $36.00

Industry Price:    $72.00

 

 

IPC New Release: IPC-T-50K

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

 

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.

 

120 pages. Released July 2013.

 

Hard copy:

Member Price:   $46.00

Industry Price:    $93.00

 

 

 

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