Bonjour Ioan, ou BonBon? Has Werner said so? I doubt. Well, as usual I do same as Dough does when he has no answer, I open with 'It depends'. I mean that most anomalies sooner or later end wth an open, even with less than 90%. Now, what do you offer us? BGA-, SOIC-, DIL-, Connector- solder joints or what? And as Igor use to trumpete 'dune yur hume lessun-cross section' and send to us for optimal discusson. As it's Friday Tom Orrow, something may crack.... Inge On 25 June 2013 05:34, Ioan Tempea <[log in to unmask]> wrote: > Dear Technos, > > I remember Werner stating that an open circuit will appear if the crack > covers 90% of the joint (or via hole circumference), so even if we have > about 10% of unbroken contact. Is there any written evidence of that? > > Thanks, > > Ioan Tempea, ing. > Ingénieur de fabrication / Manufacturing Engineer > [cid:[log in to unmask]] > 514-457-2150 #3556 > > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________