Jeff：

 

有看到PCB 的切片图， VOID 的底部漏铜， 很有可能是PCB 拒焊所致， 可以试一下：

 

1.       提高焊接头温度至380度

2.       延长焊锡时间 至2-3 Sec

3.       或改用3.0% 左右FULX 含量的焊锡线。

 

Rgds

 

Jake

 

From: Jeff Chen [mailto:[log in to unmask]]
Sent: 2013年5月9日 13:30
To: Jake Tu
Cc: [log in to unmask]
Subject: Re: [TGAsia] Soldering bubble problem root

 

Hi Jake,

It's robotic soldering. Pls see the following parameter:

Setting time: Pre-heating time:0.5s

                     Soldering temperature 350degree and Duration:1.0s

Thanks and best regards.

Jeff

 

[log in to unmask]" alt=page1image256>[log in to unmask]" alt=page1image256>



Look like PCB issue

What's soldering process application for this project? Used wave soldering / robot soldering or reflow (PIH)...

What's the parameter settings?

Rgds

Jake

-----Original Message-----
From: TGAsia [mailto:TGAsia@ipc.org] On Behalf Of Jeff Chen
Sent: 2013年5月9日 12:20
To: [log in to unmask]
Subject: [TGAsia] Soldering bubble problem root


Dear All,

One of my customer feedback the bubble problem when soldering. The defective sample is as the following cross section chart.

Would you pls kindly help to analysis the root reason of  this problem?
Usually which situation will cause the soldering bubble problem?

Thanks very much for your time and your effort.

Best regards.
Jeff Chen


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