Robert, How about placing them in a vacuum chamber. That would release all the moisture and definitely if you could add a little heat. I would envision separating the boards with a mesh and spacer to allow the moisture to fully escape. Placing a paper towel between layers might not let all the moisture escape. But then this is just my opinion. Phil Nutting -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner Sent: Tuesday, April 09, 2013 12:54 PM To: [log in to unmask] Subject: [TN] Pakeout and PCB Separators Hi, Does anyone know if separators of some type between PCBs can reduce bake out time? If I have a stack of PCBs, and I place something like paper towels between PCBs, can the bake out time be reduced? I would imagine the diffusion rates of moisture in the paper towel material would be much higher than in solid PCB laminate. But, that is just a guess. Could be perfect hog wash. My problem is not with PCBs but with 30 mil sheets of plastic that feed a thermoforming process. I am using PETG but I still see small bubbles in the material after forming. I tried a short bake out, and it helps, but I cannot heat very high as the 30 mil plastic sheets will easily deform. I need to lay them flat, heat gently, and still try to removed moisture. I was wondering what the best way to separate sheets and allow drying might be. Any Ideas? Thanks, Bob K. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________