Robert,

How about placing them in a vacuum chamber.  That would release all the moisture and definitely if you could add a little heat.  I would envision separating the boards with a mesh and spacer to allow the moisture to fully escape.  Placing a paper towel between layers might not let all the moisture escape.

But then this is just my opinion.

Phil Nutting

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Tuesday, April 09, 2013 12:54 PM
To: [log in to unmask]
Subject: [TN] Pakeout and PCB Separators

Hi,

 

Does anyone know if separators of some type between PCBs can reduce bake out time?

 

If I have a stack of PCBs, and I place something like paper towels between PCBs, can the bake out time be reduced? I would imagine the diffusion rates of moisture in the paper towel material would be much higher than in solid PCB laminate. But, that is just a guess. Could be perfect hog wash.

 

My problem is not with PCBs but with 30 mil sheets of plastic that feed a thermoforming process.  I am using PETG but I still see small bubbles in the material after forming. I tried a short bake out, and it helps, but I cannot heat very high as the 30 mil plastic sheets will easily deform. I need to lay them flat, heat gently, and still try to removed moisture. I was wondering what the best way to separate sheets and allow drying might be.

 

Any Ideas?

 

Thanks,

Bob K.

 



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