No problem, until it is turned on. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo Sent: Monday, April 08, 2013 1:46 PM To: [log in to unmask] Subject: Re: [TN] copper nanosolder--fyi Space application. Yet, it is a big vacuum. Purest and most clean controlled environments. As long as in side, no big problem. Outside, you might have to worry about atomic oxygen, proton, UV, hot and cold, and of course, many junk can hit you. etc. Joyce Koo Researcher Materials Interconnect Lab Office: (519) 888-7465 79945 BlackBerry: (226) 220-4760 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey Sent: Monday, April 08, 2013 4:27 PM To: [log in to unmask] Subject: Re: [TN] copper nanosolder--fyi Yes, note that lead-free solder may not be used in space because of accelerated tin whiskering. Lockheed Space had an incentive to develop a replacement. As a veteran of the lost battle against the tin industry, I could not be happier that the war is not lost. --- On Mon, 4/8/13, Wayne Thayer <[log in to unmask]> wrote: From: Wayne Thayer <[log in to unmask]> Subject: Re: [TN] copper nanosolder--fyi To: [log in to unmask] Date: Monday, April 8, 2013, 12:04 PM Lockheed's stuff is focused on solder replacement, not Printed Electronics. ________________________________________ From: TechNet [[log in to unmask]] on behalf of Mike Buetow [[log in to unmask]] Sent: Monday, April 08, 2013 2:45 PM To: [log in to unmask] Subject: Re: [TN] copper nanosolder--fyi Printed Electronics. Mike Buetow PCB CHAT: Come chat April 23 about the top 50 EMS Companies: www.pcbchat.com The 2013 CIRCUITS ASSEMBLY Directory of EMS Companies: circuitsassembly.com/dems -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer Sent: Monday, April 08, 2013 2:05 PM To: [log in to unmask] Subject: Re: [TN] copper nanosolder--fyi PE? ________________________________________ From: TechNet [[log in to unmask]] on behalf of Joyce Koo [[log in to unmask]] Sent: Monday, April 08, 2013 11:17 AM To: [log in to unmask] Subject: Re: [TN] copper nanosolder--fyi Double layer conduction? Might be shielding layer for EMI/EMC. That would be perfect application for PE. Joyce Koo Researcher Materials Interconnect Lab Office: (519) 888-7465 79945 BlackBerry: (226) 220-4760 -----Original Message----- From: Mike Fenner [mailto:[log in to unmask]] Sent: Monday, April 08, 2013 10:09 AM To: 'TechNet E-Mail Forum'; Joyce Koo Subject: RE: [TN] copper nanosolder--fyi Good summary Joyce. I think its clear that PE, with or without nano will not be replacing high speed digital circuitry for some time yet, its opportunities are elsewhere. There are plenty of examples already. Having said that it's interesting to look at display technology and the additional printed circuitry applied to conventional metal track PCBs. That's kind of PE by the back door. To me PE is just a subset of 3D printing, added layer manufacturing, call it what you will, in fact is part of it. Regards Mike Fenner Bonding Services & Products M: +44 [0] 7810 526 317 T: +44 [0] 1865 522 663 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo Sent: Monday, April 08, 2013 2:47 PM To: [log in to unmask] Subject: Re: [TN] copper nanosolder--fyi Many thanks Harvey. I would very much interest to know the detail of the presentation. The nano particles are utilized in printed electronics, in various elements and organic conductive media to improve conductivity and flexibility. Normally, printed electronics are processed in low temperature with large surface contact area (roll to roll printing). Therefore, it can be flexible and thin, the resistance short coming of the nano-particles due its large surface/interface characteristics (sometimes, it is hopping rather than normal conduction mechanism) are compensated by large conduction contact surfaces and thin joints. Sintering/fusing of the nano-particle can be done at lower temperature due to highly active surface energy, however, unless performed under pressure, you might get un-controlled re-crystallization and growth of the grain, resulted preferential growth of certain orientation of grain and leave some voids behind (low angle co-incidence grain boundary, as well as twining, are stable boundary, but not high angle gain boundary)- you might get more conductivity loss in high frequency and resistance increase. Of course, all the oxidation must be taking care of (copper is very readily oxidized, even with OSP coated, with that much surface area (nano particle). Acid media is more less like a flux can take care some of surface oxidation, but you still need to control the coalescence and growth (not all orientation are grow at same rate...). The existing solder interconnect is heading towards smaller, more compact (solid) joints, for example, flip chip, or TSV for high speed, high density interconnect (in line with the high density IC with node of <20 nm). The solder interconnect joints more in the 3D stack, rather than 2D in printed electronics. High surface/interface might be good for some application, such as low frequency, low temperature application, I am a bit curious how it can be apply to the high frequency, high I/O, short and dense interconnect at lower voltage, and high device temperature (current processor dissipated 40-100W in some cases). Looking forward to see the presentation (I would really appreciated if you can share with us). I haven't been in the field for long time, Looking forward to update my knowledge. Thanks. My 2 cents. Best regards, Joyce Koo Researcher Materials Interconnect Lab Office: (519) 888-7465 79945 BlackBerry: (226) 220-4760 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey Sent: Saturday, April 06, 2013 9:16 PM To: [log in to unmask] Subject: [TN] copper nanosolder--fyi Biltmore Santa Clara for dinner (or non-dinner) June 12, 2013. Dr. Zinn's bio and abstract are at the end. Lockheed's nano-copper solder is an answer to the lead-free solder fiasco. Remember "the non-solution to the non-problem", that is, until we get rid of most solder altogether, most solder paste, anyhow. Speaker: Alfred Zinn, Lockheed Martin Space System Company ATC, Senior Scientist Abstract: NanoCopper Materials Platform for Electronic Packaging and Printed Electronics with 200 °C Processing Temperature The Advanced Technology Center of the Lockheed Martin Corporation has developed a nanocopper-based material that can be fused to bulk copper around 200 °C taking advantage of the rapidly decreasing fusion temperature with decreasing particle size at the nanoscale. The nanocopper material has the potential to replace tin-based solder to eliminate whisker growth and mechanical reliability concerns encountered with current lead-free solder. Fully optimized, the fused copper is expected to exhibit 10-15x electrical and thermal conductivity improvements over tin-based materials currently in use. The materials platform is enabled by our scalable Cu nanoparticle fabrication process employing a low cost solution-phase chemical reduction approach. A proprietary mixture of surfactants controls particle size and size distribution as well as stabilizing the particles preventing particle growth and oxidation, which would otherwise degrade its activity. We have demonstrated assembly of fully functional LED test boards using a paste formulated with nanocopper that exhibits a consistency very similar to standard tin-based solder paste. To date, we have demonstrated 26-pin through-hole connector assembly and a variety of surface mount components. We demonstrated feasibility of drop-in solder replacement using standard stencil and pick & place packaging equipment as well as demonstrated feasibility of using the material for printed electronics applications. Dr. Zinn received his Doctor of Science degree in Chemistry in 1990 from the Philipps University, Marburg, Germany. Following completion of his graduate studies, Dr. Zinn spent five years at UCLA as a lecturer and conducting postdoctoral research on low-temperature CVD for interconnect, diffusion, and migration barrier deposition, as well as magnetic nanomaterials design and synthesis. In 2004, he joined Lockheed Martin Space Systems Company Advanced technology Center in Palo Alto, CA developing high-temperature materials systems, nanostructured functional materials (electrical, thermal, thermoelectric), modeling quantum/superlattice structures and devices, high performance energy conversion devices (solar, high & low quality heat conversion). He holds seven patents in materials, structures and processing, two THz technology patents, with ten additional patents pending (multiple international filings) as well as four trade secrets. He has authored or co-authored over 20 archival journal publications, including book chapters in "The Chemistry of Metal CVD" as well as the "Encyclopedia of Inorganic Chemistry. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. 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