Hi Paul, You are right, BUT I've never said that there were lifted lands. Considering the size of those areas, I wouldn't expect the lands to be lifted. Well, separation acts as a crack (stress concentrator). Which way the crack will propagate (through the laminate or along the interface) depends on which one is the weaker. Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca -----Original Message----- From: Paul Reid <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Thu, 18 Apr 2013 08:31:21 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]> Subject: Re: [TN] BGA pads Hi Vladimir, I believe that this is a rejectable condition. IPC 6012, paragraph 3.3.4, states that there will be no lifted lands on an unstressed printed board. BTW - If you have a separation between the laminate and the copper then you cannot have cratering because the copper is not adhered to the laminate. Sincerely, Paul Reid Program Coordinator PWB Interconnect Solutions Inc. 235 Stafford Rd., West, Unit 103 Nepean, Ontario Canada, K2H 9C1 613 596 4244 ext. 229 Skype paul_reid_pwb [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev Sent: April 17, 2013 6:47 PM To: [log in to unmask] Subject: [TN] BGA pads Techneters, I have another tricky question. We see separation at the Cu pad/laminate interface. The area is rather small (20 microns in section), BUT it's located at the periphery of BGA pads. My concern is that the separation will act as a stress concentrator causing pad cratering, once the BGA is placed. I'm positive it's a real scenario, as we investigated a similar case over a year ago. According to 6012C the board is acceptable (at least from my understanding). The question is: Is there a way to legitimately reject the board? Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________