Oxidation...Oxygeg.question for Bob: Remember our little discussion on 'zero' . What I ask now has no practical application. I have had the thought before when I used ultrahigh vacuum (exp -12)..Now to question: Is it possible to remove all oxygen molecules in a volum made of xxxxx. I mean zero molecules, not one single molecule. Or is there a place in Universe where a Oxygen atom is unthinkable? Inge On 10 April 2013 16:54, Robert Kondner <[log in to unmask]> wrote: > I will agree about oxidation but not faster drying. I mean the vapor > pressure of water is already quite low at room temperature. I think drying > time for a material with absorbed vapor is fixed by diffusion rates and > distance. And temperature is a bit driver of diffusion rate. Is air > pressure > even in the equation? > > Bob K. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah > Sent: Tuesday, April 09, 2013 2:12 PM > To: [log in to unmask] > Subject: Re: [TN] Pakeout and PCB Separators > > Baking in Vacuum oven = less pads oxidation and faster drying > > > On Tue, Apr 9, 2013 at 9:00 PM, Glidden, Kevin > <[log in to unmask]>wrote: > > > Someone in Technet not long ago posted up an excellent little write up > > from Gordon Davy about water vapor and drying. I've attached it to > > Phil and Bob. > > > > It contends vacuum ovens do nothing to increase drying rate. > > > > Drying is a function of temperature and delta between concentration of > > water in the middle versus at the surface. > > > > I presume, like any drying, the greater the surface area exposed the > > faster the drying. I would place the PCBs (as much as possible) > > directly on racks or in card holders (on edge). > > > > -----Original Message----- > > From: Nutting, Phil [mailto:[log in to unmask]] > > Sent: Tuesday, April 09, 2013 1:01 PM > > To: [log in to unmask] > > Subject: Re: [TN] Pakeout and PCB Separators > > > > Robert, > > > > How about placing them in a vacuum chamber. That would release all > > the moisture and definitely if you could add a little heat. I would > > envision separating the boards with a mesh and spacer to allow the > > moisture to fully escape. Placing a paper towel between layers might > > not let all the moisture escape. > > > > But then this is just my opinion. > > > > Phil Nutting > > > > -----Original Message----- > > From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner > > Sent: Tuesday, April 09, 2013 12:54 PM > > To: [log in to unmask] > > Subject: [TN] Pakeout and PCB Separators > > > > Hi, > > > > > > > > Does anyone know if separators of some type between PCBs can reduce > > bake out time? > > > > > > > > If I have a stack of PCBs, and I place something like paper towels > > between PCBs, can the bake out time be reduced? I would imagine the > > diffusion rates of moisture in the paper towel material would be much > > higher than in solid PCB laminate. But, that is just a guess. Could be > perfect hog wash. > > > > > > > > My problem is not with PCBs but with 30 mil sheets of plastic that > > feed a thermoforming process. I am using PETG but I still see small > > bubbles in the material after forming. I tried a short bake out, and > > it helps, but I cannot heat very high as the 30 mil plastic sheets > > will easily deform. I need to lay them flat, heat gently, and still > > try to removed moisture. I was wondering what the best way to separate > > sheets and allow drying might be. > > > > > > > > Any Ideas? > > > > > > > > Thanks, > > > > Bob K. > > > > > > > > > > > > ______________________________________________________________________ > > This email has been scanned by the Symantec Email Security.cloud service. > > For more information please contact helpdesk at x2960 or > > [log in to unmask] > > ________________ > > > > ______________________________________________________________________ > > This email has been scanned by the Symantec Email Security.cloud service. > > For more information please contact helpdesk at x2960 or > > [log in to unmask] > > ________________ > > > > ______________________________________________________________________ > > This email has been scanned by the Symantec Email Security.cloud service. > > For more information please contact helpdesk at x2960 or > > [log in to unmask] > > ______________________________________________________________________ > > > > > > -- > > Best Regards, > > *Reuven Rokah* > > Mobile: 972-52-6012018 > Tel: 972-3-9360688 > Fax: 076-5100674 > <http://www.rokah-technologies.com/>[log in to unmask] > [log in to unmask] > www.rokah-technologies.com > > ** > This e-mail message is intended for the recipient only and contains > information which is CONFIDENTIAL and which may be proprietary of Rokah > Technologies. If you have received this transmission in error, please > inform > me by e-mail, phone or fax, and then please delete all of the original > files > and all other copies exist. > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. 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