Techneters,

I have another tricky question.

We see separation at the Cu pad/laminate interface. The area is rather small (20 microns in section), BUT it's located at the periphery of BGA pads.

My concern is that the separation will act as a stress concentrator causing pad cratering, once the BGA is placed. 

I'm positive it's a real scenario, as we investigated a similar case over a year ago.

According to 6012C the board is acceptable (at least from my understanding).

The question is: Is there a way  to legitimately reject the board?


Regards,

Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca

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