Finally taking a few minutes to glance through some of the new IPC releases... I see a statement within IPC-7095C, specifically section 5.3.3.3, that states ENEPIG is best suited for Pb-Free soldering, and that studies have shown ENEPIG does not produce very reliable tin/lead solder joints, due to the inability of Pd to alloy with lead. I don't see any such warnings or statements in IPC -4556. Or am I missing them? If this is true, it seems like it would be a major consideration and would/should be included or mentioned in IPC-4556 Section 1.4.7 "Limitations of ENEPIG". But, I could have it all wrong. So far all I have done is glance through these new specs.... Kevin Glidden ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________