ENIG Ioan Tempea, ing. Ingénieur principal de fabrication / Senior Manufacturing Engineer [signature002]<http://www.digico.cc/> 950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f> T+ 1 (450) 967-7100, EXT244 ------------------------------------------------------------------------ [signature001] <http://www.facebook.com/pages/Digico/277076778479> ------------------------------------------------------------------------ Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/> Entreprise manufacturière / Gestion du capital humain De : [log in to unmask] [mailto:[log in to unmask]] Envoyé : March-01-13 2:30 PM À : TechNet E-Mail Forum; Ioan Tempea Objet : Re: [TN] Conductive path failure in thermal cycling Hi Ioan - what is the assembly surface finish? Dave Hillman Rockwell Collins [log in to unmask]<mailto:[log in to unmask]> From: Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>> To: <[log in to unmask]<mailto:[log in to unmask]>> Date: 03/01/2013 10:40 AM Subject: [TN] Conductive path failure in thermal cycling Sent by: TechNet <[log in to unmask]<mailto:[log in to unmask]>> ________________________________ Dear Technos, RoHS assembly, soldered with SAC305 alloy, 0.075" thick 14 layers PCB, failing after 250 cycles (-20 C to 125 C). Failure mode is crack between the traces and pad at 3 places. Happens on 2 TH components. Traces are 0.0055" wide, pads are 0.022" in diameter on the via side or 0.065" on the component side. There is no tear dropping. Should I bother figuring out if manual soldering of the TH component fragilizes the trace-pad junction, or this is an obvious case of design induced failure? Thanks, Ioan Tempea, ing. Ingénieur principal de fabrication / Senior Manufacturing Engineer [signature002]<http://www.digico.cc/> 950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f> T+ 1 (450) 967-7100, EXT244 ------------------------------------------------------------------------ [signature001] <http://www.facebook.com/pages/Digico/277076778479> ------------------------------------------------------------------------ Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/> Entreprise manufacturière / Gestion du capital humain ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________