I can not think of any unless dipping doesn't remove enough Au and Au is a possibility. Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca -----Original Message----- From: Gregg Owens <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Tue, 12 Mar 2013 22:43:00 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Gregg Owens <[log in to unmask]> Subject: [TN] Mixing Solders I have an industry friend who asked me the following question and I did not have a good enough reply. So I thought I would put it out there on TechNet. What are the possible problems with tin dipping a gold plated contact with 63/37 then soldering it in a (PCB) board using 60/40 solder ? 2. What arguments could I use to move away from using the 60/40 and use just the 63/37 for the product (i.e. Do you believe one has any benefit over the other)? 3. Are you aware of any problems mixing the solder types ? (63 / 37 and 60 / 40) Your thoughts and comments are appreciated. Gregg Owens ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________