Hi Ioan, Not much I can see from the picture. You can send it to us if you want to. Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca -----Original Message----- From: Ioan Tempea <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Mon, 4 Mar 2013 14:22:57 To: <[log in to unmask]> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]> Subject: Re: [TN] Conductive path failure in thermal cycling Thanks Dave, Completely lost trace of Steve, please check this link http://ipc-technet.groupsite.com/galleries/show/25304 Unfortunately, I only have 1 pic. Ioan Tempea, ing. Ingénieur principal de fabrication / Senior Manufacturing Engineer [signature002]<http://www.digico.cc/> 950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f> T+ 1 (450) 967-7100, EXT244 ------------------------------------------------------------------------ [signature001] <http://www.facebook.com/pages/Digico/277076778479> ------------------------------------------------------------------------ Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/> Entreprise manufacturière / Gestion du capital humain De : [log in to unmask] [mailto:[log in to unmask]] Envoyé : March-04-13 9:09 AM À : TechNet E-Mail Forum; Ioan Tempea Objet : Re: [TN] Conductive path failure in thermal cycling Hi Ioan - I have recently ran into an plating process issue with immersion silver - the term being used to describe the anomaly is "trench etch". This defect is made worst by lead-free soldering processes where copper dissolution comes into play. Your defect sounds like it could be "trench etch" but you have ENIG and not immersion silver. Please send Steve a couple of pictures of your defect and we'll try to sleuth out the root cause. Dave From: Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>> To: <[log in to unmask]<mailto:[log in to unmask]>> Date: 03/01/2013 03:08 PM Subject: Re: [TN] Conductive path failure in thermal cycling Sent by: TechNet <[log in to unmask]<mailto:[log in to unmask]>> ________________________________ ENIG Ioan Tempea, ing. Ingénieur principal de fabrication / Senior Manufacturing Engineer [signature002]<http://www.digico.cc/> 950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f> T+ 1 (450) 967-7100, EXT244 ------------------------------------------------------------------------ [signature001] <http://www.facebook.com/pages/Digico/277076778479> ------------------------------------------------------------------------ Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/> Entreprise manufacturière / Gestion du capital humain De : [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]] Envoyé : March-01-13 2:30 PM À : TechNet E-Mail Forum; Ioan Tempea Objet : Re: [TN] Conductive path failure in thermal cycling Hi Ioan - what is the assembly surface finish? Dave Hillman Rockwell Collins [log in to unmask]<mailto:[log in to unmask]> From: Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>> To: <[log in to unmask]<mailto:[log in to unmask]>> Date: 03/01/2013 10:40 AM Subject: [TN] Conductive path failure in thermal cycling Sent by: TechNet <[log in to unmask]<mailto:[log in to unmask]>> ________________________________ Dear Technos, RoHS assembly, soldered with SAC305 alloy, 0.075" thick 14 layers PCB, failing after 250 cycles (-20 C to 125 C). Failure mode is crack between the traces and pad at 3 places. Happens on 2 TH components. Traces are 0.0055" wide, pads are 0.022" in diameter on the via side or 0.065" on the component side. There is no tear dropping. Should I bother figuring out if manual soldering of the TH component fragilizes the trace-pad junction, or this is an obvious case of design induced failure? Thanks, Ioan Tempea, ing. Ingénieur principal de fabrication / Senior Manufacturing Engineer [signature002]<http://www.digico.cc/> 950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f> T+ 1 (450) 967-7100, EXT244 ------------------------------------------------------------------------ [signature001] <http://www.facebook.com/pages/Digico/277076778479> ------------------------------------------------------------------------ Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/> Entreprise manufacturière / Gestion du capital humain ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________