Yes, that is exactly how it was done; a plated through hole that was filled and they overplated to form a BGA pad? I obviously have cross-sectional SEM images and can send couple of them to Steve if he doesn't mind. Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca -----Original Message----- From: Robert Kondner <[log in to unmask]> Sender: TechNet <[log in to unmask]> Date: Wed, 13 Mar 2013 17:51:14 To: <[log in to unmask]> Reply-To: <[log in to unmask]> Subject: Re: [TN] IPC-6012 Hi, First, Got Pictures and/or cross sections? Maybe some info about the size of via and size of pad would help. By chance was this a plated through hole that was filled and they over plated to form a BGA pad? Bob K. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev. PhD Sent: Wednesday, March 13, 2013 5:18 PM To: [log in to unmask] Subject: [TN] IPC-6012 I have a question for boards gurus, We run a set of tests to assess the workmanship of a PWB. The board had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA. After a thermal stress the pads were partially flitted due to cracked laminated underneath them. To me it's a recipe for disaster (like pad cratering after assembly). However, I saw nothing about it in IPC-6012. Did I just miss it? I'd really appreciate any contractive comments. -- Best regards, Vladimir Igoshev. PhD mailto:[log in to unmask] SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________