Hi Paul, I'm not sure if that particular situation can be considered as a typical case of "lifted pad of a PTH". If it was just a PTH and not a solder pad for a BGA, I'd have never asked. The presence of a BGA on those pads might (and strongly suspect will) make those cracks to grow/propagate. Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca -----Original Message----- From: "Paul Reid" <[log in to unmask]> Date: Thu, 14 Mar 2013 08:25:17 To: TechNet E-Mail Forum<[log in to unmask]>; Vladimir Igoshev. PhD<[log in to unmask]>; <[log in to unmask]> Subject: RE: [TN] IPC-6012 Hi Vladimir, What you have here is a lifted pad. I think that that is rejectable to 6012. There appears to be an adiquate wrap of copper. Best regards, Paul Reid ________________________________ From: TechNet on behalf of Vladimir Igoshev. PhD Sent: Wed 13/03/2013 5:18 PM To: [log in to unmask] Subject: [TN] IPC-6012 I have a question for boards gurus, We run a set of tests to assess the workmanship of a PWB. The board had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA. After a thermal stress the pads were partially flitted due to cracked laminated underneath them. To me it's a recipe for disaster (like pad cratering after assembly). However, I saw nothing about it in IPC-6012. Did I just miss it? I'd really appreciate any contractive comments. -- Best regards, Vladimir Igoshev. PhD mailto:[log in to unmask] SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________