I have been following this QFN discussion as about a year ago I worked a reliability problem for a QFN user. One thing I noted is that the standoff is (of course) low. For anybody who is using QFNs: Have you done a Werner Engelmaier style mechanical reliability analysis on the parts? Just asking. I saw them being used for avionics and was a little concerned about whether any planes I was to be flying on used QFNs. Greg Munie PhD IPC Technical Conference Director 630-209-1683 [log in to unmask] http://www.ipcapexexpo.org/ http://www.ipc.org -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Schaefer Sent: Saturday, February 23, 2013 11:33 AM To: [log in to unmask] Subject: Re: [TN] 48-pin QFN via-in-pad solder slug problem. I am currently working on a design with 2 similar QFNs requiring via in slug for thermal and electrical reasons. IPC-4761 gives a good summary of methods for handling these components; IPC-4761 Type VII (filled and conductively capped) appears to be the only sure bet solution. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________