I vote on non-functional pads out. You get an area that is resin poor if you have a stack of non-functional pads. The stack of pancakes, as it were, "telegraphs" the image of the pads to the outer layers. The resin in the stack is depleted because there is copper on every layer. What we suggest is to leave three or four non-functional pads in but not in the center zone of the board. Sincerely, Paul Reid Program Coordinator PWB Interconnect Solutions Inc. 235 Stafford Rd., West, Unit 103 Nepean, Ontario Canada, K2H 9C1 613 596 4244 ext. 229 Skype paul_reid_pwb [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David Bealer Sent: January 17, 2013 4:13 PM To: [log in to unmask] Subject: [TN] PCB design/build question about via construction On an internal copper plane(pour) where a via intersects the plane but doesn't connect, should we remove the pad on that plane for that via? I would think that it would add some measure of structural support for the via if we left it in place. Am I wrong? Thanks, David Bealer ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________