谢谢你的帮助,
附件的PCB是RF
Module的底面板,我们用风枪吹下来的由于功能失败,拆下后发现此类现象,如果严重氧化的话,表面的镀金层应该还是存在当吹下来后(黄色的),但现在是灰色的..
不知道我的想法对不对???.
嚴重氧化了。
请问附图中的PAD位上锡不良
（回流焊）可能是什么原因造成，
手焊没有问题（针对那些上锡不良的PAD位），回流焊曲线没有问题，不良率5%，仅发生在一个批次，表面看不出明显的氧化。。。
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