请教各位同仁: 我在做BGA返工的时候遇到一类BGA,焊接加热后BGA上边的锡球没有熔化,焊不上去。 我暂时的做法是,将原料BGA上边的锡球清除,再重新对BGA植球,然后再进行焊接。但是这样的做法费时、另外多次对BGA加热,存在质量隐患的风险。 不知道大家有没有遇到这种情况,或者有什么好的方法可以借鉴。 谢谢。 ________________________________ From: TGAsia [mailto:[log in to unmask]] On Behalf Of Shan Zhenfeng Sent: Tuesday, December 11, 2012 11:18 AM To: [log in to unmask] Subject: [TGAsia] 电子元件和PCB用真空包装机 Hello: 请各位推荐效果比较好的真空包装机。 Thanks! Best regards Shan Zhenfeng Continental Automotive Changchun Co., Ltd. 0431 84684793 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ TGAsia是一个为业界同仁提供技术交流的平台。您可以在论坛上提出技术问题,交流行业经验,寻找供应商等。请勿发送任何招聘,广告信息。(注:对于寻求供应商的邮件,请勿回复[log in to unmask],请私下和发件人联系)。如您需要退出该邮件论坛,请直接发送邮件至 [log in to unmask] ,谢谢。 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________