No, it is for an industrial application If you are using a no-clean process, confirm the process residues left behind will not impact the potting material in a negative manner. Something to watch for if and when you change your processes (solder paste and or wave flux) Ted T. From: Inge Hernefjord [mailto:[log in to unmask]] Sent: Thursday, December 06, 2012 4:16 PM To: TechNet E-Mail Forum; Tontis, Theodore Subject: Re: [TN] PCB assembly potted evaluation validation Is it a MIL product? Inge On 6 December 2012 20:02, Tontis, Theodore <[log in to unmask]> wrote: Angel, There needs to be a functional pre and post pot test. The Pre-pot test will insure you are not potting defective material that you cannot rework after potting. Post -Pot will identify any defects that might have occurred during the potting process or defects they might have made it through the previous screening process. As for validation of the process itself it would depend on the end use environment. Here are some tests I have used in the past to confirm a potting process as well as process capability. 1. Water submersion testing in a pressure chamber to simulate water submersions at different depths. (The product needed to function in periodic depths of water up to 30ft) 2. Cross sectioning after potting to confirm 100% coverage of the potting material as well as adhesion to the walls of the enclosure 3. Salt Fog and functional/cross sectioning 4. HALT and HAST testing Regards, Ted T. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski Sent: Thursday, December 06, 2012 10:05 AM To: [log in to unmask] Subject: Re: [TN] PCB assembly potted evaluation validation Typically AABUS. Function testing of some type based on purpose & environment of the end use. Some type of drop or HALT test might be nice. Rich Kraszewski (920)969-6075 <tel:%28920%29969-6075> -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Reyes, Angel LAM2 4429 Sent: Wednesday, December 05, 2012 10:43 PM To: [log in to unmask] Subject: [TN] PCB assembly potted evaluation validation Importance: High Hello TechNetters; Does any one know or recommend any test standard to validate performance and reliability for PCB (FR4 0.031" THCK) double side SMT assemblies potted with epoxy or polyurethane Regards, Angel ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________